Alpha Metals RF800T No-Clean Flux
• Medium Solids Content • Pin Testable • Non Corrosive Residues • High Sir Assemblies
Alpha RF 800T is a low solids, no-clean flux formulated with a small percentage of rosin and non-halide activators. This unique rosin activation system promotes excellent wetting to protected copper and solder coated surfaces. Post soldering residue of Alpha RF 800T is minimal, slightly glossy and can be pin tested without removal.
Alpha RF 800T flux is formulated to be applied with foam, wave, spray and mist fluxers. Flux deposition, density and uniformity are critical to successful use of low solids no-clean flux. Applying RF 800T to a dry flux coating density of 100 to 300 micrograms per square centimetre is recommended. Preheating the circuit assembly will partially dry the flux, enhance oxide removal and promote optimum wicking, as well as superior solder joint formation. Degree of preheat is dependent on many variables; such as conveyor speed, type of components and substrates. Entering the solder wave with a top-side temperature of 90°C to 110°C and a bottom-side temperature of 120°C to 155°C is typical.
The foam applicators should be supplied with compressed air, free of oil and water. Maintain flux fluid level sufficiently above the aerator to produce adequate foam height. Adjust air pressure to produce optimum height with foam consisting of uniform bubbles. The addition of flux thinners will be required to replace evaporative losses and maintain the balance in flux composition. Due to the low solids content of Alpha RF 800T flux, specific gravity is not an accurate measure for assessment. Monitoring and controlling the acid number is recommended for maintaining the flux composition. The acid number should be controlled between 21 and 22.
In time, debris and contaminants will accumulate in recirculating type flux applicators. For consistent soldering performance, dispose of spent flux in accordance with local bylaws, rules and regulations periodically. After emptying used flux, the reservoir and applicator should be thoroughly cleaned with flux thinner. Refill reservoir with fresh flux and allow a few minutes to stabilise before resuming soldering operation. In this type of flux application equipment, replace flux every 3 days where used daily for eight hours or more.
Although Alpha RF 800T is designed to be left on the board, if desired, post soldering residues can be removed with Alpha 2110 saponifier, Hydrex DX detergent or alternatively a semi-aqueous process using Alpha Auto Clean 40 may be employed.
Key factors for no-clean soldering: Start with clean boards and components. Maintain uniform flux coating. Separate boards to prevent flux carry-over.
GENERAL GUIDELINES FOR MACHINE SETTINGS
Foam Stone Pore Size 20 -50 μm Distance that top of stone is submerged below flux 25 - 40 mm (1 - 1½ inches ) Foam Fluxer Chimney Opening 10-13 mm ( 3/8 - 1/2 inch) Topside Preheat Temperature 90°C – 100°C Bottomside Preheat Temperature about35°C higher than topside Maximum Ramp Rate of Topside Temperature (to avoid 2°C/second maximum component damage) Conveyor Angle 5°-8° (6° most common) Conveyor Speed 4 - 6 feet/minute (1.2 - 1.5 meters/minute) Contact Time in the Solder (includes Chip Wave and Primary 1.5 - 3.5 seconds (2-2½ seconds most common) Wave) Solder Pot Temperature Nominal 245°C conveyor speed, topside preheat temperature, and solder pot temperature).
TECHNICAL SPECIFICATIONS Parameters Typical Values Parameters/Test Method Typical Values Appearance Pale, yellow liquid Recommended Thinner 800T Additive Solids Content, wt/wt 5.0 Shelf Life 18 Months Acid Number (mg KOH/g) 21.6 Container Size Availability 20, 200L Specific Gravity @ 25°C (77°F) 0.800 ± 0.003 Bellcore TR-NWT-000078, Issue 3 Compliant Yes Flash Point (T.C.C.) 13°C IPC J-STD-004 Designation B (RO/L1)
The information contained in this document has been prepared in good faith and is offered at no charge. No warranty is given that the information herein is accurate or complete. Errors and omissions excepted. It is the buyers responsibility to determine the products fitness for any particular purpose. REV0SURFACE INSULATION RESISTANCE (all values in ohms) Method Conditions Requirement Results 8 9 IPC-SF-818 (cleaned) 85°C/85%RH (7 days) 1.0 x 10 min. 5.88 x 10
8 9 IPC-SF-818 (uncleaned) 85°C/85%RH (7 days) 1.0 x 10 min. 2.94 x 10
Bellcore TR-TSY-000078 Comb Pattern “Up” (uncleaned) 35°C/85%RH 5 days 9.85 x 1010 min. 3.2 x 1012 Comb Pattern “Down” (uncleaned) 35°C/85%RH 5 days 9.85 x 1010 min. 3.1 x 1011 Comb Pattern “Down” (cleaned) 35°C/85%RH 5 days 9.85 x 1010 min. 1.7 x 1012
For enquiries, assistance and support, contact Technical Services, Alpha Metals UK. Telephone: 020-8665 6666 Fax: 020-8665 4737
Alpha RF 800T is available in 20 litre containers.
HANDLING AND SAFETY
Observe standard precautions for handling and use. Use in well ventilated areas. DO NOT SMOKE. Avoid prolonged or repeated contact with the skin by the use of solvent resistant gloves. Avoid contact with eyes.
Flammable, keep away from sparks and open flames. Empty containers can still be a flammable hazard from residual vapours.
Remove skin splashes by immediate washing with soap and water. In order to carry out your full COSHH assessment, consult the product Material Safety Data Sheet (MSDS).